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Evaluation and modeling of the high-temperature short-term creep performance of selected class-filled semicrystalline and liquid crystalline polymers

机译:所选类填充半结晶和液晶聚合物高温短期蠕变性能的评估和建模

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摘要

The creep performance of a material is one of the main criteria currently used to assess the long-term performance of thermoplastic composites. In a wide number of applications, including electrical connectors and various automotive applications, dimensional stability at elevated temperatures (i.e., short-term creep performance) is an essential design requirement. In many of these applications the material can be exposed to elevated temperatures and high applied stresses as part of the fabrication process or in the end-use application. The elevated temperature creep behavior of 30%, and 40% glass-filled syndiotactic polystyrene, 30% glass-filled poly(butylene terephthalate), 30% glass-filled poly( phenylene sulfide), and a 30% glass-filled liquid crystalline polymer has been evaluated. The creep behavior for each of the materials has been modeled using the formulation proposed by Findley, Kholsa, and Petersen (FKP). The FKP model was found to provide a good description of the creep performance of these glass-filled materials. The parameters in the FKP model were evaluated for each of the materials as a function of temperature and applied stress. Comparison of the predicted short-term creep behavior using the FKP model with experimental data has shown that the predicted creep behavior is within +/-10% of the measured value over the temperature and applied stress ranges examined. (C) 1998 John Wiley & Sons, Inc. [References: 26]
机译:材料的蠕变性能是目前用于评估热塑性复合材料长期性能的主要标准之一。在包括电连接器和各种汽车应用的许多应用中,高温下的尺寸稳定性(即短期蠕变性能)是基本的设计要求。在许多这些应用中,作为制造过程的一部分或在最终用途中,材料可能会暴露于高温和高施加应力下。 30%和40%玻璃填充的间规聚苯乙烯,30%玻璃填充的聚对苯二甲酸丁二酯,30%玻璃填充的聚苯硫醚和30%玻璃填充的液晶聚合物的高温蠕变行为已评估。已使用Findley,Kholsa和Petersen(FKP)提出的公式对每种材料的蠕变行为进行了建模。发现FKP模型可以很好地描述这些玻璃填充材料的蠕变性能。针对每种材料,根据温度和施加的应力评估FKP模型中的参数。使用FKP模型将预测的短期蠕变行为与实验数据进行比较,结果表明,在检查的温度和施加的应力范围内,预测的蠕变行为在测量值的+/- 10%范围内。 (C)1998 John Wiley&Sons,Inc. [参考:26]

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