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首页> 外文期刊>Journal of Alloys and Compounds: An Interdisciplinary Journal of Materials Science and Solid-state Chemistry and Physics >Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during Isothermal aging
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Coupling effects at Cu(Ni)-SnAgCu-Cu(Ni) sandwich solder joint during Isothermal aging

机译：等温时效过程中Cu（Ni）-SnAgCu-Cu（Ni）夹层焊点的耦合效应

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摘要

Interfacial reactions and consumption of metallization during liquid reaction and isothermal aging at 175 deg C for Cu-SnAgCu-Cu, Ni-SnAgCu-Ni and Cu-SnAgCu-Ni solder joints were investigated. Interfacial microstructures were characterized by scanning electron microscopy (SEM) and energy dispersive X-ray (EDX). Optical microscopy (OM) was employed to measure the consumed thickness of metallization layer. A coupling effect occurs between Cu/SnAgCu and Ni/SnAgCu interfaces at Cu-SnAgCu-Ni solder joint. The inter-diffusion of Cu and Ni atoms contributes to the formation of ternary (Cu,Ni)6Sn5 IMCs at both interfaces. The Ni(P) layer in Ni-Ni solder joint is fully depleted and changes to Ni3P after aging 500 h. However, due to the coupling effect, the consumption of Ni(P) layer is limited and the Cu consumption is accelerated compared to Cu-Cu and Ni-Ni solder joint, which prevents the Ni(P) layer from being depleted and improves the reliability.
机译：研究了Cu-SnAgCu-Cu，Ni-SnAgCu-Ni和Cu-SnAgCu-Ni焊点在液相反应和175°C等温时效过程中的界面反应和金属化消耗。通过扫描电子显微镜（SEM）和能量色散X射线（EDX）表征界面微结构。使用光学显微镜（OM）来测量金属化层的消耗厚度。 Cu / SnAgCu-Ni焊点处的Cu / SnAgCu和Ni / SnAgCu界面之间会发生耦合效应。 Cu和Ni原子的相互扩散有助于在两个界面上形成三元（Cu，Ni）6Sn5 IMC。 Ni-Ni焊点中的Ni（P）层已完全耗尽，并在老化500小时后变为Ni3P。但是，由于耦合效应，与Cu-Cu和Ni-Ni焊点相比，Ni（P）层的消耗受到限制，并且Cu消耗加快，这可以防止Ni（P）层耗尽并改善Ni（P）层可靠性。

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