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首页> 外文期刊>Journal of biomedical materials research. Part B, Applied biomaterials. >Tissue colonization from implantable biomaterials with low numbers of bacteria.
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Tissue colonization from implantable biomaterials with low numbers of bacteria.

机译:来自细菌含量低的可植入生物材料的组织定植。

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摘要

This study was undertaken to evaluate the risk of infection (defined as the recovery of the relevant organism from the implant site) in a mouse model when low numbers of bacteria were present on an implanted biomaterial. Segments of different types of suture with adherent bacteria were implanted subcutaneously into mice. The infection risk with Staphylococcus aureus was greater than with Staphylococcus epidermidis RP62A or Candida albicans. The infection risk with the implantation of multifilament sutures was significantly greater than with monofilament sutures. When <10 colony forming units (cfu) of S. aureus were present on monofilament suture material, the infection rate was 3%. When <10 cfu of S. aureus were present on multifilament suture material, the infection rate was 7%. An infection rate of 15% occurred with <10 cfu of S. aureus on multifilament nylon sutures. When >10 but <20 cfu of S. aureus were present, the infection rates were 4 and 51%, respectively. These data confirm that the infection rate with multifilament sutures (or porous materials) is greater than with monofilament sutures (or solid materials) when the organisms are encountered at implantation (acute model) and indicate that a significant risk of infection may occur when only a few organisms are on a device at implantation. Copyright 1999 John Wiley & Sons, Inc.
机译:进行这项研究是为了评估当植入的生物材料中细菌数量较少时,小鼠模型中的感染风险(定义为从植入部位回收相关生物)。将具有粘附细菌的不同类型的缝合线段皮下植入小鼠。金黄色葡萄球菌的感染风险高于表皮葡萄球菌RP62A或白色念珠菌。植入多丝缝线的感染风险明显高于单丝缝线。当在单丝缝线材料上出现<10个金黄色葡萄球菌的菌落形成单位(cfu)时,感染率为3%。当复丝缝合材料上存在<10 cfu的金黄色葡萄球菌时,感染率为7%。 <10 cfu的金黄色葡萄球菌在复丝尼龙缝合线上的感染率为15%。当存在> 10但<20 cfu的金黄色葡萄球菌时,感染率分别为4%和51%。这些数据证实,在植入时(急性模型)遇到生物时,复丝缝合线(或多孔材料)的感染率大于单丝缝合线(或固体材料)的感染率,并且表明当仅使用单丝缝合线(或多孔材料)时,感染的风险可能很大。植入时,几乎没有有机体在设备上。版权所有1999 John Wiley&Sons,Inc.

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