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首页> 外文期刊>Journal of Composites Technology & Research >Stress and failure analyses of adhesive-bonded composite joints using ASTM D3165 specimens
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Stress and failure analyses of adhesive-bonded composite joints using ASTM D3165 specimens

机译：使用ASTM D3165试样对粘合复合材料接头的应力和破坏进行分析

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An analytical model was developed to determine the stress and strain distributions of single-lap adhesive-bonded composite joints under tension. Both the adherend and the adhesive were assumed linear elastic in the derivations. The Laminated Plate Theory was used in defining the mechanical behavior of the composite adherends, whereas the linear elasticity theory was applied to describe the material response of the adhesive. By doing so, the stresses in the adhesive can vary through the bondline thickness. After the overall system of governing equations was determined by energy method, it was solved by using a symbolic solver-Maple with appropriate boundary conditions. Results from the analytical model were verified with finite element analysis using commercial software ABAQUS. Single-lap composite joint experiments were conducted following ASTM D3165, Strength Properties of Adhesives in Shear by Tension Loading of Single-Lap-Joint Laminated Assemblies. Although all three failure modes of bonded joints, substrate, cohesive, and adhesive failure, were present as the experimental results, the substrate failure mode was the major failure mode observed. Therefore, only substrate failure mode was analyzed using the developed model in the present paper. Four failure criteria, Tsai-Hill failure criterion, von Mises failure criterion, maximum interlaminar tensile stress criterion, and maximum normal stress criterion, were used to correlate the stresses and failure load. Nonlinear regression was conducted to determine the necessary parameters in the failure criteria. Based on the experimental results, thicker bondlines result in weaker joints. The variation of failure load for joints with various bondline thicknesses was consistent with the predicted results. [References: 33]
机译：建立了一种分析模型来确定单搭接的复合材料复合材料接头在应力下的应力和应变分布。在推导中，被粘物和粘合剂均假定为线性弹性。层压板理论用于定义复合材料的机械性能，而线弹性理论则用于描述粘合剂的材料响应。这样，粘合剂中的应力会随着粘合线的厚度而变化。用能量法确定整个控制方程组后，使用具有适当边界条件的符号求解器Maple对其进行求解。使用商业软件ABAQUS对分析模型的结果进行有限元分析验证。遵循ASTM D3165，单搭接层压组件的拉伸载荷，剪切时胶粘剂的强度特性，进行了单搭接复合接头实验。尽管出现了粘结接头的所有三种破坏模式，即基底破坏，内聚破坏和粘合破坏，但基底破坏模式是观察到的主要破坏模式。因此，在本文中仅使用开发的模型来分析基板故障模式。四个失效准则，Tsai-Hill失效准则，von Mises失效准则，最大层间拉伸应力准则和最大法向应力准则被用于将应力和失效载荷关联起来。进行非线性回归以确定失效准则中的必要参数。根据实验结果，较厚的粘结线会导致接头较弱。具有不同粘结层厚度的接头的破坏载荷变化与预测结果一致。 [参考：33]

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