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首页> 外文期刊>Journal of Electronic Testing: Theory and Applications: Theory and Applications >Calibrating On-chip Thermal Sensors in Integrated Circuits: A Design-for-Calibration Approach
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Calibrating On-chip Thermal Sensors in Integrated Circuits: A Design-for-Calibration Approach

机译：校准集成电路中的片上热传感器：一种用于校准的设计方法

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摘要

With the scaling of technology, thermal issues have started to adversely affect reliability, performance, and robustness of integrated circuits. As a result, many recent research papers have focused on the use of embedded thermal sensors to monitor the temperature profile within the IC and manage the on-chip resources to keep the temperatures within acceptable limits. However, due to increasing process variations and parameter drifts, temperature measurements by these thermal sensors may not be accurate unless these on-chip sensors are calibrated before shipping the devices to the users. Existing calibration methods are either time-consuming or assume that the sensors do not require calibration for they use very large area which makes them insensitive to variations and drifts. In this paper, we propose a design-for-calibration (DFC) approach for calibrating the embedded thermal sensors in the manufacturing environment. Simulation results demonstrate the effectiveness and accuracy of our approach. The impact of uncertainties in parameters on the accuracy of calibration is also investigated in the paper.
机译：随着技术的发展，热问题已经开始对集成电路的可靠性，性能和鲁棒性产生不利影响。结果，许多近期的研究论文都集中在嵌入式热传感器的使用上，以监控IC内的温度曲线并管理片上资源，以将温度保持在可接受的范围内。但是，由于工艺变化和参数漂移的增加，除非在将器件交付给用户之前对这些片上传感器进行了校准，否则这些热传感器进行的温度测量可能并不准确。现有的校准方法既费时又假定传感器不需要校准，因为它们使用的面积非常大，这使其对变化和漂移不敏感。在本文中，我们提出了一种用于校准的设计（DFC）方法，用于在制造环境中校准嵌入式热传感器。仿真结果证明了我们方法的有效性和准确性。本文还研究了参数不确定性对校准精度的影响。

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