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首页> 外文期刊>Journal of Electronic Materials >Effect of Thermoelectric and Electrical Properties on the Cooling Performance of a Micro Thermoelectric Cooler
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Effect of Thermoelectric and Electrical Properties on the Cooling Performance of a Micro Thermoelectric Cooler

机译：热电和电性能对微型热电冷却器冷却性能的影响

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摘要

Active cooling has been studied to prevent microprocessor temperature rise due to hot spots, and a micro thermoelectric cooler is a promising candidate for this spot cooling since it can be used to effectively cool the small area near the hot spot. Numerical analysis has been conducted to determine the effect of thermoelectric and electrical properties on the cooling performance of such a micro thermoelectric cooler. In the cooler considered herein, Bi_(2)Te_(3) and Sb_(2)Te_(3) were selected as the n- and p-type thermoelectric materials, respectively. The thermoelectric column considered was 20 (mu)m thick. The coefficient of performance (COP) and cooling rate were the primary factors used to evaluate the performance of the cooler. Although cooling performance varies with thermal conditions such as thermophysical properties and temperature difference, the present study only focuses on the effect of thermoelectric and electrical properties such as the Seebeck coefficient and electrical resistivity.
机译：已经研究了主动冷却以防止微处理器由于热点而引起的温度升高，并且微热电冷却器是这种热点冷却的有前途的候选者，因为它可用于有效地冷却热点附近的小区域。已经进行了数值分析，以确定热电和电性能对这种微型热电冷却器的冷却性能的影响。在本文考虑的冷却器中，分别选择Bi_（2）Te_（3）和Sb_（2）Te_（3）作为n型和p型热电材料。所考虑的热电柱为20μm厚。性能系数（COP）和冷却速率是用于评估冷却器性能的主要因素。尽管冷却性能随热条件（例如热物理性质和温度差）的变化而变化，但本研究仅关注热电和电性质（例如塞贝克系数和电阻率）的影响。

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