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首页> 外文期刊>Journal of Electronic Materials >Effects of Palladium and Solder Aging on Mechanical and Fatigue Properties of Tin-Lead Eutectic Solder
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Effects of Palladium and Solder Aging on Mechanical and Fatigue Properties of Tin-Lead Eutectic Solder

机译：钯和焊锡时效对锡铅共晶焊锡力学和疲劳性能的影响

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摘要

The effects of(a) 0.5 wt. % of Pd addition, and (b) aging on mechanical and fatigue properties of eutectic solder (63Sn37Pb) were investigated. The creep rate of eutectic solder at room temperature is not affected by Pd addition. However, at 80℃, solder containing Pd creeps slower than Sn-Pb eutectic. Strain rate dramatically affects yield and tensile stress of eutectic solder with Pd as it does for the binary solder. Isothermal fatigue life of solder at 25℃ is essentially not changed by Pd addition. The microstructure of Pd-containing solder consisted of polyhedral grains of (Pb), (Sn), and a dispersion of PdSn↓(4) intermetallic. Significant microstructural changes and interphase interface phenomena take place during creep deformation at 25 and 80℃. Ambient aging for seven years leads to solder softening and to moderate increase in isothermal fatigue life.
机译：（a）0.5 wt。研究了Pd添加量的％和（b）时效对共晶焊料（63Sn37Pb）的机械和疲劳性能的影响。共晶焊料在室温下的蠕变速率不受Pd添加的影响。然而，在80℃时，含Pd的焊料蠕变慢于Sn-Pb共晶。与二元焊料一样，应变速率会极大地影响Pd共晶焊料的屈服和拉伸应力。添加Pd基本上不会改变25℃焊料的等温疲劳寿命。含Pd焊料的微观结构由（Pb），（Sn）的多面体晶粒和PdSn↓（4）金属间化合物的分散体组成。在25和80℃蠕变变形期间发生了明显的微结构变化和相界面现象。环境老化7年会导致焊料软化并适度增加等温疲劳寿命。

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