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首页> 外文期刊>Journal of Failure Analysis and Prevention >Finite Element Analysis of Mono- and Bi-Adhesively Bonded Functionally Graded Adherend
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Finite Element Analysis of Mono- and Bi-Adhesively Bonded Functionally Graded Adherend

机译：单和双胶粘剂功能梯度被粘物的有限元分析

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摘要

The stress concentration at the end of bonded lap joints is a major concern in the design and application of adhesive joints, and, therefore, many research works have been carried out to reduce the stress level in the bond line. Most of the proposed methods focus on changing adhesive geometries or properties to achieve an optimized model. In this paper, the stress and strain distribution for adherend with functionally graded properties was analyzed to investigate the effect of the adherend material properties and the type of joint on the stress distribution within bond line. The effect of ceramic volume fraction of the functionally graded materials (FGMs) on the stress concentration has been studied. Also, bi-adhesive joint is used as an alternative stress reduction technique for the joint. Results show that using bi-adhesively joint technique together with high-ceramic volume fraction FGMs can significantly reduce the shear and peel stress in the lap joint.
机译：搭接接头末端的应力集中是胶接接头设计和应用中的主要问题，因此，为降低粘接线中的应力水平，已进行了许多研究工作。大多数提议的方法都集中在改变粘合剂的几何形状或特性以实现优化的模型上。本文分析了具有功能梯度性能的被粘物的应力和应变分布，以研究被粘物的材料性能和接缝类型对键合线内应力分布的影响。研究了功能梯度材料（FGM）的陶瓷体积分数对应力集中的影响。同样，双胶接头被用作接头的替代应力降低技术。结果表明，采用双胶粘剂结合高陶瓷体积分数的FGM可以显着降低搭接处的剪切应力和剥离应力。

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