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首页> 外文期刊>Journal of Failure Analysis and Prevention >Failure Analysis of Micro Cracks and Alumina Inclusions Induced Insulator Pin's Low Stress Mode of Fracture
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Failure Analysis of Micro Cracks and Alumina Inclusions Induced Insulator Pin's Low Stress Mode of Fracture

机译:微裂纹和氧化铝夹杂物引起的绝缘子销钉低应力断裂模式的失效分析

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摘要

A tensile test must be conducted for each finished insulator in which a common but significant problem is a low stress mode of fracture. In order to investigate the cause of the low stress fracture in a batch of insulators, a series of failure analysis methods were carried out. As described in this paper, macro-fracture analysis, SEM observation, EDS examination, metallographic structure analysis, hardness test, and inclusion rating were all conducted on the investigation. The results of this investigation show that the major cause of incident fracture is micro cracks in the pin, which are the result of both the molding method and the heating treatment. However, the major reason for the macro cracks lies in the induction heating process, which lacked the accurate temperature control method and using of higher electric power. Furthermore, alumina inclusions in the pin were in excess of standard, so they may also have contributed to the low stress fracture of the pin.
机译:必须对每个成品绝缘子进行拉伸测试,其中常见但重要的问题是低应力断裂模式。为了研究一批绝缘子低应力断裂的原因,进行了一系列失效分析方法。如本文所述,在调查中进行了宏观断裂分析,SEM观察,EDS检查,金相组织分析,硬度测试和夹杂物评级。研究结果表明,造成断裂的主要原因是销钉中的微裂纹,这是成型方法和热处理的结果。然而,产生宏观裂纹的主要原因在于感应加热过程,该过程缺乏精确的温度控制方法和较高的电功率使用。此外,针中的氧化铝夹杂物含量超过标准,因此它们也可能导致针的低应力断裂。

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