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首页> 外文期刊>Journal of Electromagnetic Waves and Applications >Improved physical model in layered media for via structures
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Improved physical model in layered media for via structures

机译:分层介质中用于孔结构的改进物理模型

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In this paper, the physical model is extended for vias embedded in layered media between two parallel-plate pairs. The effect of this inhomogeneity on signal integrity analysis is crucial, but is rarely studied especially by using the equivalent circuit model. The model presented in this paper is constituted by upper and lower via-to-plane capacitances which are different from each other due to the inhomogeneous dielectrics and equivalent impedance matrix of the parallel-plate cavity with equivalent wave number. The via-to-plate capacitance with layered media is calculated by using cascaded Green's function with image theory and integral equation method based on partial capacitance, which is the main contribution in this paper. The parallel-plate impedance is calculated by using the cavity resonator method. Transverse resonance method as well as an equivalent approximation method is used for wave number evaluation. For the first time, the circuit model presented in this paper is used for the issue of layered media, which is much simpler with sufficient accuracy up to 20GHz when compared with analytical method. The model is validated with full-wave simulations.
机译:在本文中,物理模型扩展为嵌入在两个平行板对之间的分层介质中的过孔。这种不均匀性对信号完整性分析的影响至关重要,但很少研究,特别是通过使用等效电路模型进行研究。本文提出的模型是由上下通孔电容组成的,这是由于电介质的不均匀和平行板腔具有等效波数的等效阻抗矩阵而导致的。本文利用图像理论的级联格林函数和基于局部电容的积分方程方法,计算了层状介质的通孔至平板的电容,这是本文的主要贡献。平行板阻抗是通过使用腔谐振器方法来计算的。横向共振法以及等效近似法用于波数评估。本文首次提出的电路模型用于分层介质的问题,与分析方法相比,该模型要简单得多,具有高达20GHz的精度。该模型已通过全波仿真验证。

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