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首页> 外文期刊>Journal of industrial and engineering chemistry >Effect of PI film surface on printing of Pd(II) catalytic ink for electroless copper plating in the printed electronics
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Effect of PI film surface on printing of Pd(II) catalytic ink for electroless copper plating in the printed electronics

机译：PI膜表面对印刷电子产品中化学镀铜Pd（II）催化油墨印刷的影响

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摘要

Pd(II) catalytic ink was synthesized by the hydrolysis of PdCl2, followed by treatment with a small amount of stabilizing agent. The Pd(II) ink has excellent storage stability and the same low viscosity and surface tension as water. Polyimide film was used as a substrate for inkjet printing of the Pd(II) ink, while various characteristic changes of the printing were observed according to the contact angle on the substrate surface. The contact angle was affected by the concentration of KOH solution, and a surface condition suitable for composing Copper circuit was obtained by printing Pd(II) catalyst ink and electroless plating when it was treated in 1 M KOH solution for 10 min. The physical properties of Pd(II) ink were analyzed using a surface tension meter, viscometer, pH meter and UV-visible spectrophotometer, whereas the surface properties of polyimide film were analyzed using a contact angle instrument, FTIR-ATR, video microscope, XPS, FESEM and AFM. The physical properties of Pd(O) particles were analyzed by XPS and AFM, while the characteristics of electroless copper plating were analyzed by video microscope and XPS.
机译：通过PdCl2的水解合成Pd（II）催化油墨，然后用少量的稳定剂处理。 Pd（II）墨水具有出色的存储稳定性，并且具有与水相同的低粘度和表面张力。聚酰亚胺膜用作Pd（II）墨水的喷墨印刷基材，同时根据基材表面的接触角观察到印刷的各种特性变化。接触角受KOH溶液浓度的影响，在1M KOH溶液中处理10分钟后，通过印刷Pd（II）催化剂墨水和化学镀层，可获得适合组成铜电路的表面条件。使用表面张力计，粘度计，pH计和紫外可见分光光度计分析Pd（II）油墨的物理性质，而使用接触角仪，FTIR-ATR，视频显微镜，XPS分析聚酰亚胺膜的表面性质。 ，FESEM和AFM。用XPS和AFM分析了Pd（O）颗粒的物理性质，而用视频显微镜和XPS分析了化学镀铜的特性。

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