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首页> 外文期刊>Journal of industrial and engineering chemistry >Optimization of barrel plating process for electroless Ni-P plating
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Optimization of barrel plating process for electroless Ni-P plating

机译：化学镀Ni-P的滚镀工艺优化

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A plating test was carried out with changes in the concentration of nickel sulfate (NiSO4) and sodium hypophosphite (NaH2PO2) to analyze the plating characteristics depending on the balance of the electroless Ni-P plating solution. The coating thickness increased with the concentrations of NiSO4 and NaH2PO2. The optimum concentrations for electroless Ni-P plating were 27.0 g/L for NiSO4, and 24.0 g/L for NaH2PO2. The coating thickness was thicker at up to pH 4, but it was thinner after that. The deviations in the coating thickness decreased at up to pH 4, but it was increased after that. So the optimum pH of the plating solution was 4. Barrel plating was carried out while varying the open pore ratio, barrel rotation speed, plating temperature, and plating time, which revealed that the coating thickness was increased with the open pore ratio and barrel rotation speed. Therefore, the optimum open pore ratio and barrel rotation speed in electroless Ni-P plating were 22.5% and 2.5 rpm, respectively.
机译：通过改变硫酸镍（NiSO4）和次磷酸钠（NaH2PO2）的浓度进行镀覆测试，以根据化学镀Ni-P镀液的平衡来分析镀覆特性。涂层厚度随NiSO4和NaH2PO2的浓度而增加。化学镀Ni-P的最佳浓度对于NiSO4为27.0 g / L，对于NaH2PO2为24.0 g / L。在pH高达4时，涂层厚度较厚，但此后较薄。在pH高达4时，涂层厚度的偏差减小，但此后增大。因此，镀液的最佳pH值为4。在改变开孔率，料筒旋转速度，镀敷温度和镀敷时间的同时进行了滚筒镀覆，结果表明，随着开孔率和料筒旋转的增加，涂层厚度增加。速度。因此，化学镀Ni-P的最佳开孔率和料筒转速分别为22.5％和2.5 rpm。

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