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首页> 外文期刊>Journal of Materials Processing Technology >Drilled hole damage of small diameter drilling in printed wiring board
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Drilled hole damage of small diameter drilling in printed wiring board

机译：印刷线路板小直径钻孔的钻孔损坏

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摘要

Of late, it has become necessary to improve the packaging density of printed wiring board (PWB), because the demand for size reduction of the electric devices is increasing. Therefore, the pitches between through holes in electric circuits have become fine for the high package density. On the other hand, various forms of damage occur around the holes after drilling. Much research has been done on internal damage in order to prevent the reduction of the insulation resistance between the holes after through hole plating, and the blow holes after soldering. This study is about the damage factors around the drilled hole wall in small diameter drilling of an PWB in order to prevent the ion migration between the holes.It is shown that there are two important factors of internal damage around the drilled hole: (1) the relative angles between cutting directions and fibre directions; (2) fibre bundle thickness of glass cloth at the drilled hole wall. In particular, it is demonstrated that the reduction of the fibre bundle thickness is effective to decrease the internal damage of drilled hole.
机译：最近，由于对减小电子设备的尺寸的需求不断增加，因此有必要提高印刷线路板（PWB）的封装密度。因此，由于高封装密度，电路中通孔之间的间距变得很小。另一方面，钻孔后在孔周围发生各种形式的损坏。为了防止通孔镀覆后的孔与钎焊后的气孔之间的绝缘电阻降低，对内部损伤进行了大量的研究。这项研究是关于在PWB的小直径钻孔中钻孔壁周围的破坏因素，以防止孔之间的离子迁移。研究表明，钻孔周围的内部破坏有两个重要因素：（1）切割方向和纤维方向之间的相对角度; （2）玻璃纤维束在钻孔壁处的厚度。特别地，证明了减小纤维束厚度对于减少钻孔的内部损伤是有效的。

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