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首页> 外文期刊>Journal of Materials Science >PHYSICAL PROPERTIES OF PULSED CURRENT COPPER ELECTRODEPOSITS
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PHYSICAL PROPERTIES OF PULSED CURRENT COPPER ELECTRODEPOSITS

机译:脉冲电流铜电极的物理性质

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摘要

Square-wave unipolar pulse electroplating and bipolar pulse reverse electroplating of copper using an acid copper electrolyte of the type used for printed circuit boa rd production has been studied. The effects of pulse-plated coatings on cathode efficiency and on the coatings properties, such as surface roughness, microhardness, stress-strain characteristics and elongation, are reported. The results show that microhardness, tensile strength and elongation are directly affected by the pulse technique used. [References: 26]
机译:已经研究了使用用于印刷电路板制造的酸性铜电解质对铜进行方波单极性脉冲电镀和双极性脉冲反向电镀。报道了脉冲镀膜对阴极效率和镀膜性能的影响,例如表面粗糙度,显微硬度,应力应变特性和伸长率。结果表明,所用脉冲技术直接影响显微硬度,抗张强度和伸长率。 [参考:26]

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