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Variability Characterisation of Nanoscale Si and InGaAs Fin Field-Effect-Transistors at Subthreshold

机译:阈值以下的纳米级Si和InGaAs鳍式场效应晶体管的变异性表征

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摘要

Device characteristic variability induced by Line Edge Roughness (LER) and Metal Gate Work function (MGW) is simulated and compared in two nanoscaled fin field-effect-transistors (FinFETs) with Si and InGaAs channel materials. The study is carried out using a workload manager developed to deploy the simulations and to collect the data across different computational infrastructures. We have found that for the most of the figures of merit, the InGaAs channel device is more tolerant to the LER and MGW variability sources. The MGW has a larger impact (14% more for InGaAs and 33% more for Si) than the LER variability. We have also found a larger correlation between the threshold voltages at low and high drain biases of the InGaAs FinFET than of the Si counterpart.
机译:在两个具有Si和InGaAs沟道材料的纳米级鳍式场效应晶体管(FinFET)中,模拟并比较了由线边缘粗糙度(LER)和金属栅极功函数(MGW)引起的器件特性变化。这项研究是使用工作负荷管理器进行的,该工作负荷管理器开发用于部署模拟并收集不同计算基础架构中的数据。我们发现,对于大多数性能指标而言,InGaAs通道设备对LER和MGW可变性源的容忍度更高。 MGW具有比LER可变性更大的影响(InGaAs增加14%,Si增加33%)。我们还发现,InGaAs FinFET在低漏极偏压和高漏极偏压下的阈值电压之间的相关性比硅对应物更大。

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