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首页> 外文期刊>Journal of Materials Chemistry, C. materials for optical and electronic devices >Self-reducible copper inks composed of copper-amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate
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Self-reducible copper inks composed of copper-amino complexes and preset submicron copper seeds for thick conductive patterns on a flexible substrate

机译：由铜-氨基配合物和预设的亚微米铜种子组成的自还原铜油墨，用于在柔性基材上形成厚的导电图案

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摘要

Low-temperature and self-reducible copper inks composed of copper amino complexes and proper submicron copper seeds are successfully developed, which can increase the copper load of inks to achieve high performance thick and dense conductive patterns. During the heat treatment, the preset copper seeds provide heterogeneous nucleation sites for metallic copper generated from the decomposition of self-reducible copper amino complexes. These fresh copper nuclei homogeneously attach to the copper seeds to activate their surface, which contributes to the connection and neck-growth between these submicron copper seeds to achieve high conductive copper patterns. The effects of the size of copper seeds and the ratio of the amount of copper amino complexes to seeds on the electrical resistivity and morphology of sintered copper patterns are clarified, and the functions of the heat treatment temperature and holding time are investigated. The results show that the sintered copper pattern with a high metal load of 36.8%, prepared by heat treatment at a low temperature of 140 degrees C for only 15 min under nitrogen atmosphere, achieves a low resistivity of 11.3 mu Omega cm. Furthermore, the sintered patterns maintain a high-qualitative surface morphology and favorable thickness, and also exhibit a strong adhesion to polymer substrates which will be advantageous for the fabrication of wearable devices.
机译：成功开发了由铜氨基配合物和适当的亚微米铜种子组成的低温自还原铜油墨，可以增加油墨的铜负荷，从而获得高性能的厚而致密的导电图案。在热处理过程中，预设的铜晶种为自还原性铜氨基配合物分解产生的金属铜提供了异质形核位点。这些新鲜的铜核均匀地附着在铜种子上，以激活其表面，这有助于这些亚微米铜种子之间的连接和颈部生长，从而实现高导电性铜图案。阐明了铜种子尺寸和铜氨基配合物与种子的比例对烧结铜图案的电阻率和形态的影响，并研究了热处理温度和保温时间的作用。结果表明，通过在氮气氛下在140摄氏度的低温下仅热处理15分钟而制备的具有36.8％的高金属负载的铜烧结图案，其电阻率低至11.3μOΩcm。此外，烧结的图案保持高质量的表面形态和有利的厚度，并且还表现出对聚合物基材的强粘附性，这对可穿戴设备的制造将是有利的。

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