首页> 外文期刊>Journal of Materials Engineering and Performance >Oxygen Stoichiometry and Surface Treatment Effect on Electromigration Stability of High-T_c Tl_2Ba_2Cu)_(6+2) Superconductor
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Oxygen Stoichiometry and Surface Treatment Effect on Electromigration Stability of High-T_c Tl_2Ba_2Cu)_(6+2) Superconductor

机译:氧化学计量学和表面处理对高T_c Tl_2Ba_2Cu)_(6 + 2)超导体电迁移稳定性的影响

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摘要

Electromigration stability of Tl_2Ba_2CuO_(6+x) ceramics is shown to decrease significantly when the material Is treated in water vapor atmosphere. The T_c decrease in these samples is accompanied by a resistance Increase, while the Seebeck coefficient, S, remains unchanged. The authors conclude that the main effect comes from grain-boundary degradation under the water vapor treatment. For Initial samples, electromigration stability strongly depends on the sample oxygen doping level and increases for materials with higher oxygen content. The effect is assumed to be due to the filling of interstitials in Ti-O layers by oxygen atoms.
机译:当在水蒸气气氛中处理该材料时,Tl_2Ba_2CuO_(6 + x)陶瓷的电迁移稳定性显着降低。这些样品中的T_c下降伴随着电阻增加,而塞贝克系数S保持不变。作者得出结论,主要影响来自水蒸气处理下的晶界降解。对于初始样品,电迁移稳定性在很大程度上取决于样品中的氧掺杂水平,对于氧含量较高的材料,电迁移稳定性会增加。认为该效果是由于氧原子填充了Ti-O层中的间隙。

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