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Wetting Characteristics of Novel-type 63Sn-29.2Pb-6Zn-1Ag-0.38Cu-0.42Bi Solder Alloy

机译:新型63Sn-29.2Pb-6Zn-1Ag-0.38Cu-0.42Bi焊料合金的润湿特性

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摘要

6061 aluminum alloy has many advantages, and soldering is the most attractive joining method for 6061 aluminum alloy. In order to expand application of 6061 aluminum alloy, a novel 63Sn-29.2Pb-6Zn-1Ag-0.38Cu-0.42Bi solder alloy was prepared. The melting characteristic and microstructure of the solder were analyzed by differential scanning calorimetry and scanning electron microscope. Its spreading on the 6061 aluminum alloy was also studied. The results show that its melting temperature range is 456.34-463.68 K, and the temperature interval between the solidus and the liquidus is 6.34 K. The solder on 6061 aluminum alloy had better wetting characteristics. A precursor film appears ahead of the spreading droplet. The microstructure at the interface between the solder and the 6061 aluminum alloy was analyzed. It was clear that the intermetallic compound, Ag_2Al phase, was formed at the interface between the solder and the 6061 aluminum alloy.
机译:6061铝合金具有许多优点,而焊接是6061铝合金最吸引人的连接方法。为了扩大6061铝合金的应用范围,制备了新型的63Sn-29.2Pb-6Zn-1Ag-0.38Cu-0.42Bi焊料合金。通过差示扫描量热法和扫描电子显微镜分析了焊料的熔融特性和微观结构。还研究了它在6061铝合金上的扩散。结果表明,其熔化温度范围为456.34-463.68 K,固相线和液相线的温度间隔为6.34K。6061铝合金上的焊料具有较好的润湿特性。前驱膜出现在散布的液滴之前。分析了焊料和6061铝合金之间界面的微观结构。显然,在焊料和6061铝合金之间的界面处形成了金属间化合物Ag_2Al相。

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