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首页> 外文期刊>Journal of Materials Engineering and Performance >Microstructure and hardness of hollow cathode discharge ion-plated titanium nitride film
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Microstructure and hardness of hollow cathode discharge ion-plated titanium nitride film

机译：空心阴极放电离子镀氮化钛膜的组织与硬度

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摘要

Titanium nitride (TiN) films were deposited on 304 stainless steel substrate by hollow cathode discharge (HCD) ion-plating technique. The preferred orientation and microstructure were studied by x-ray diffraction (XRD) and transmission electronmicroscopy (TEM), respectively. Microhardness of the TiN film was measured and correlated to the microstructure and preferred orientation. The results of TEM study showed that the microstructure of TiN film contains grains with nanometer scale. As thefilm thickness increases, the grain size of TIN increase. The x-ray results show that TiN(111) is the major preferred orientation of the film. The hardness of TiN film is primarily contributed from TiN(111) preferred orientation.
机译：通过空心阴极放电（HCD）离子镀技术将氮化钛（TiN）膜沉积在304不锈钢基板上。通过X射线衍射（XRD）和透射电子显微镜（TEM）分别研究了优选的取向和微观结构。测量了TiN膜的显微硬度，并将其与显微组织和优选的取向相关。 TEM研究的结果表明，TiN膜的微观结构含有纳米级晶粒。随着膜厚度的增加，TIN的晶粒尺寸增加。 X射线结果表明，TiN（111）是薄膜的主要首选取向。 TiN膜的硬度主要来自TiN（111）的首选取向。

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