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Analysis of Titanium-Coated Glass and Imidex (PI) Laser Bonded Samples

机译：钛涂层玻璃和Imidex（PI）激光粘合样品的分析

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Based on previous results of bond strength, scanning electron microscopy(SEM)/energy dispersive spectroscopy (EDS) and x-ray photoelectron spectroscopy (for thin film thickness in the range of 50 to 200 nm range), it is expected for a moderate film thickness of titanium (over 50 nm) for the system of sputtered Ti-coated glass/polymer two factors play important roles in getting strong bond between Ti/Polyimide interface: (i) mechanical interlocking property and (ii) chemical bond formation such as Ti-C, Ti-O between Ti and imidex (PI) film. In this study, a systematic investigation has been conducted to understand the effects of thin films on bond quality and on failure mechanism of the interface between 400 nm sputtered Ti-coated glass/imidex (PI) system. This article basically studies if for this higher film thickness the failure pattern and bond strength are consistent with the previous data. From previous studies (for thin film thickness of 50 to 200 nm) the conclusion extracted is thin film with thickness of less than 50 nm exhibited low bond strength when compared to film thickness over 50 nm and from the results obtained in this study it is concluded that the bond reliability and failure modes of sputtered Ti film on glass are consistent even for a film thickness as high as 400 nm and three types of failure modes are found: (i) cohesive failure mode, (ii) Ti/glass interface failure mode, and (iii) glass failure mode. The roughness value for this coating thickness is 17 nm.
机译：根据先前的粘合强度，扫描电子显微镜（SEM）/能量色散光谱（EDS）和X射线光电子能谱（对于50到200 nm范围内的薄膜厚度）的结果，可以预期得到中等厚度的薄膜对于溅射Ti涂层玻璃/聚合物体系，钛的厚度（超过50 nm）有两个因素在获得Ti / Polyimide界面之间的牢固键合方面起着重要作用：（i）机械互锁性能和（ii）化学键形成，例如Ti -C，Ti和imidex（PI）膜之间的Ti-O。在这项研究中，进行了系统的调查，以了解薄膜对键合质量的影响以及对400 nm溅射Ti涂层的玻璃/亚米德克斯（PI）系统之间界面的破坏机理的影响。本文主要研究了对于这种更高的膜厚，破坏模式和粘结强度是否与先前的数据一致。从以前的研究中（对于50到200 nm的薄膜厚度），得出的结论是，与50 nm以上的薄膜厚度相比，厚度小于50 nm的薄膜显示出低的粘结强度，并且得出的结论是即使在膜厚高达400 nm的情况下，在玻璃上溅射的Ti膜的结合可靠性和破坏模式也是一致的，并且发现了三种类型的破坏模式：（i）内聚破坏模式，（ii）Ti /玻璃界面破坏模式，以及（iii）玻璃故障模式。该涂层厚度的粗糙度值为17nm。

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