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首页> 外文期刊>Journal of Materials Engineering and Performance >Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System
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Description of the Liquidus Surface and Characterization of Alloys of the Ternary Bi-Cu-In System

机译：三元Bi-Cu-In体系液相线表面的描述和合金的表征

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摘要

Lead-free solders with copper are considered as a possible substitution for standard lead-tin solders. Ternary Bi-Cu-In system is a potential soldering material based on copper. For a more complete characterization of the ternary Bi-Cu-In system, alloys from the three vertical sections were investigated using microstructural analysis as well as by electrical conductivity and Brinell hardness measurements. The microstructures of the alloys were investigated at room temperature by application of scanning electron microscopy combined with energy dispersive spectrometry and optical microscopy. Isolines of electrical conductivity and hardness for the entire Bi-Cu-In system were calculated using regression models. In addition, a thermodynamic assessment of the system has been carried out by calculation of the isothermal section at 25℃ and description of the liquidus surface using the CALPHAD method. Experimental and analytical results were found to be in a good agreement.
机译：铜的无铅焊料被认为可以替代标准铅锡焊料。三元Bi-Cu-In系统是一种潜在的基于铜的焊接材料。为了更全面地表征三元Bi-Cu-In系统，使用了显微组织分析以及电导率和布氏硬度测量，对三个垂直截面的合金进行了研究。通过应用扫描电子显微镜结合能量色散光谱法和光学显微镜在室温下研究了合金的微观结构。使用回归模型计算了整个Bi-Cu-In系统的电导率和硬度等值线。此外，通过计算25℃的等温截面并使用CALPHAD方法描述液相线表面，对系统进行了热力学评估。实验和分析结果发现吻合良好。

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