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Development of Processing Map for 7075 Al/20% SiC_p Composite

机译:7075 Al / 20%SiC_p复合材料加工图的开发

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摘要

The hot deformation behavior and microstructure evolution of 7075 Al/20% SiC_p composite have been studied using the processing map. Compression tests were carried out in the temperature range of 300-500℃ and at the strain rate range of 0.001-1.0 s~(-1). The stable and unstable regions in the map were verified with the microstructural observations of the deformed compression specimens. The "stable" regions, i.e., dynamic recrystallization and "unstable" regions such as debonding of SiC particles, matrix crack, and adiabatic shear band formation were identified from the processing map and compared with the reported microstructural observations of the deformed compression specimens. The optimum hot working conditions for this composite were identified.
机译:利用加工图研究了7075 Al / 20%SiC_p复合材料的热变形行为和组织演变。在300-500℃的温度范围内以及在0.001-1.0 s〜(-1)的应变速率范围内进行了压缩测试。图中的稳定区域和不稳定区域通过变形压缩试样的微观结构观察得到验证。从加工图中确定了“稳定”区域,即动态再结晶和“不稳定”区域,例如SiC颗粒的脱粘,基体裂纹和绝热剪切带的形成,并与变形压缩样品的已报道的微观结构观察结果进行了比较。确定了该复合材料的最佳热加工条件。

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