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首页> 外文期刊>Journal of Materials Engineering and Performance >Grinding-induced residual stress estimation by indentation-fracture method in ground silicon nitrides
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Grinding-induced residual stress estimation by indentation-fracture method in ground silicon nitrides

机译：压痕-断裂法估算磨削氮化硅中的磨削残余应力

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摘要

An estimating procedure for grinding-induced residual stress based on the indentation-fracture (IF) method was proposed by considering a nonuniform distribution of residual stress in the specimen depth. The proposed procedure was applied to gas pressure sintered and pressureless sintered silicon nitride ceramics, which were ground under different grinding conditions. The estimated residual stress was found to be compressive for both materials. The residual stress was dominantly affected by the grit size of the grinding wheel rather than the cutting depth. Although the dependency of the estimated residual stress on the grit size was different between the two materials, it was revealed that the estimated residual stress in both materials qualitatively corresponded with the stress measured by the x-ray diffraction method. In both materials, the bending strength was reasonably correlated with the estimated residual stress. It was elucidated that the proposed procedure was applicable to a relative evaluation of the grinding-induced residual stress in machined silicon nitride ceramics.
机译：考虑到试样深度中残余应力的不均匀分布，提出了一种基于压痕-断裂（IF）方法的磨削残余应力估算程序。所提出的程序适用于在不同研磨条件下研磨的气压烧结和无压烧结氮化硅陶瓷。发现两种材料的估计残余应力都是压缩的。残余应力主要受砂轮粒度的影响，而不是切削深度的影响。尽管两种材料之间估计的残余应力对粒度的依赖性不同，但是发现两种材料中的估计残余应力在质量上与通过X射线衍射法测得的应力相对应。在这两种材料中，弯曲强度都与估计的残余应力合理相关。阐明了所提出的程序适用于机械加工氮化硅陶瓷中磨削引起的残余应力的相对评估。

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