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Defect creation kinetics in amorphous silicon thin film transistors

机译:非晶硅薄膜晶体管中的缺陷产生动力学

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摘要

The rate of defect creation in amorphous silicon thin film transistors. under gate bias stress. is proportional to N(BT)(alpha)t(beta-1), where N-BT is the bandtail carrier density. Experimentally alpha is 1.5-1.9. while beta is 0.5-0.6. We have developed a model to account for this dependence, based on an exponential distribution of barriers to defect creation. The key new feature of our model is that we include the backward reaction, as well as the forward reaction, and also the effect of the charge-state of the formed defects. Considering the forward reaction only, leads to alpha = beta, while a full analysis leads to the simple new result that alpha approximate to 3beta, which is in excellent agreement with experiments. (C) 2002 Elsevier Science B.V. All rights reserved. [References: 12]
机译:非晶硅薄膜晶体管中缺陷产生的速率。在栅极偏置应力下。与N(BT)αt(β-1)成正比,其中N-BT是带状载流子密度。实验上,alpha为1.5-1.9。而beta是0.5-0.6。我们基于缺陷产生障碍的指数分布,开发了一个模型来解决这种依赖性。我们模型的关键新特征是,我们既包括后向反应,也包括前向反应,以及所形成缺陷的电荷状态的影响。仅考虑正向反应,将得出alpha = beta,而全面分析将得出简单的新结果,即alpha接近3beta,这与实验非常吻合。 (C)2002 Elsevier Science B.V.保留所有权利。 [参考:12]

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