In this paper, a machining technique to fabricate high aspect ratio microstructure arrays of a total volume less than 1 mm 3 is developed. A method for determining the appropriate tension of the micro brass wire of the micro wire-EDM mechanism designed in our previous study is proposed, and a design for suppressing the vibration of the wire is implemented. In addition, a machining approach coined 'reverse wire-EDM' is developed. The micro wire-EDM mechanism is mounted on the worktable rather than on the machine head while the micro workpiece is clamped on the spindle instead of the worktable by a micro chuck. Machining is carried out by a horizontal moving micro brass wire of 20 mu m diameter located beneath the micro workpiece to accelerate the removal of debris and to eliminate the heat accumulated in the micro gap during machining. The possible occurrence of short circuit discharge and thermal deformation of the machined part are therefore minimized. Experiments are conducted to machine various high aspect ratio miniature structures including a microstructure array of ten 10 mu m sharp-edge lamellae at the tip, a microstructure array of ten 10 mu m uniform thickness lamellae and a microstructure array of ten by ten 21 mu m squared pillars. It is found that a microstructure array of an aspect ratio more than 33 is satisfactorily and precisely fabricated. The dimensional accuracy and geometric accuracy are less than 0.6 and 1.0 mu m, respectively, while the surface roughness R-max is kept within 0.44 mu m.
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机译：在本文中，开发了加工技术以制造总体积小于1 mm 3的高纵横比微结构阵列。提出了一种在我们之前的研究中设计的确定微细线-EDM机构的微细黄铜线适当张力的方法，并实现了一种抑制线振动的设计。此外，还开发了一种称为“反线EDM”的加工方法。微型线EDM机构安装在工作台上而不是机头上，而微型工件则通过微型卡盘而不是工作台上夹紧在主轴上。通过位于微型工件下方的水平移动的直径为20μm的微型黄铜丝进行机械加工，以加速清除碎屑并消除加工过程中微间隙中积聚的热量。因此最小化了可能发生的短路放电和加工部件的热变形。进行实验以加工各种高深宽比的微型结构，包括在顶端的10个10μm锐边薄片的微结构阵列，在10个10微米的均匀厚度的薄片中的微结构阵列和10乘10的21μm的微结构阵列。方柱。发现纵横比大于33的微结构阵列令人满意且精确地制造。尺寸精度和几何精度分别小于0.6和1.0μm，而表面粗糙度R-max保持在0.44μm之内。
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