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首页> 外文期刊>Journal of Micromechanics and Microengineering >Micromachined silicon acoustic delay line with 3D-printed micro linkers and tapered input for improved structural stability and acoustic directivity
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Micromachined silicon acoustic delay line with 3D-printed micro linkers and tapered input for improved structural stability and acoustic directivity

机译：具有3D打印的微连接器和锥形输入的微加工硅声延迟线，可改善结构稳定性和声指向性

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Recent studies have shown that micromachined silicon acoustic delay lines can provide a promising solution to achieve real-time photoacoustic tomography without the need for complex transducer arrays and data acquisition electronics. To achieve deeper imaging depth and wider field of view, a longer delay time and therefore delay length are required. However, as the length of the delay line increases, it becomes more vulnerable to structural instability due to reduced mechanical stiffness. In this paper, we report the design, fabrication, and testing of a new silicon acoustic delay line enhanced with 3D printed polymer micro linker structures. First, mechanical deformation of the silicon acoustic delay line (with and without linker structures) under gravity was simulated by using finite element method. Second, the acoustic crosstalk and acoustic attenuation caused by the polymer micro linker structures were evaluated with both numerical simulation and ultrasound transmission testing. The result shows that the use of the polymer micro linker structures significantly improves the structural stability of the silicon acoustic delay lines without creating additional acoustic attenuation and crosstalk. In addition, the improvement of the acoustic acceptance angle of the silicon acoustic delay lines was also investigated to better suppress the reception of unwanted ultrasound signals outside of the imaging plane. These two improvements are expected to provide an effective solution to eliminate current limitations on the achievable acoustic delay time and out-of-plane imaging resolution of micromachined silicon acoustic delay line arrays.
机译：最近的研究表明，微加工的硅声延迟线可以为实现实时光声层析成像提供一种有前途的解决方案，而无需复杂的换能器阵列和数据采集电子设备。为了获得更深的成像深度和更宽的视野，需要更长的延迟时间，因此需要更长的延迟时间。但是，随着延迟线的长度增加，由于机械刚度降低，延迟线更容易受到结构不稳定的影响。在本文中，我们报告了通过3D打印的聚合物微连接器结构增强的新型硅声学延迟线的设计，制造和测试。首先，利用有限元方法模拟了重力作用下的硅声延迟线（带和不带连接结构）的机械变形。其次，通过数值模拟和超声传输测试评估了由聚合物微接头结构引起的声串扰和声衰减。结果表明，使用聚合物微接头结构可显着改善硅声延迟线的结构稳定性，而不会产生额外的声衰减和串扰。另外，还研究了硅声延迟线的声接收角的改善，以更好地抑制在成像平面之外接收不想要的超声信号。预期这两项改进将提供一种有效的解决方案，以消除当前对微加工硅声延迟线阵列可实现的声延迟时间和面外成像分辨率的限制。

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