...
首页> 外文期刊>Journal of Micromechanics and Microengineering >Capacitive pressure sensors with stainless steel diaphragm and substrate
【24h】

Capacitive pressure sensors with stainless steel diaphragm and substrate

机译:电容式压力传感器,带有不锈钢膜片和基材

获取原文
获取原文并翻译 | 示例
           

摘要

Much of the cost of commercial micromachined pressure sensors lies in the package that houses the device itself. If a robust material is used for the substrate of the sensors as well as the packaging material, i.e., fabricating the sensor on the package itself, cost savings for the overall system may accrue. In this work, stainless steel has been studied as a potential robust substrate and a diaphragm material for micromachined devices. Lamination process techniques combined with traditional micromachining processes have been investigated as suitable fabrication technologies. To illustrate these principles, capacitive pressure sensors based on a stainless steel diaphragm have been designed, fabricated and characterized. Each sensor uses a stainless steel substrate, a laminated stainless steel film as a suspended movable plate and a fixed, surface micromachined back electrode of electroplated nickel. The sensitivity of the device fabricated using these technologies is 9.03 ppm kPa(-1) with a net capacitance change of 0.14 pF over a range 0-178 kPa. Two types of read-out circuitry have been introduced to microfabricated sensors for removing parasitic effects. Finally, a die-type ASIC chip was integrated and measured with this capacitive pressure. The measured value of relative voltage change was 2.85% over the applied pressure range 0-75 kPa. The sensitivity of the sensor was 0.92 mV kPa(-1) with a gap of 21 mum.
机译:商业微机械压力传感器的大部分成本都位于设备本身的包装中。如果将坚固的材料用于传感器的基板以及包装材料,即在包装本身上制造传感器,则可以节省整个系统的成本。在这项工作中,已经研究了不锈钢作为潜在的坚固基底和微机械设备的隔膜材料。层压工艺技术与传统的微加工工艺相结合已被研究为合适的制造技术。为了说明这些原理,已经设计,制造和表征了基于不锈钢膜片的电容式压力传感器。每个传感器均使用不锈钢基板,层压的不锈钢膜作为可移动的悬浮板以及固定的,表面经过微机械加工的电镀镍背面电极。使用这些技术制造的设备的灵敏度为9.03 ppm kPa(-1),在0-178 kPa范围内的净电容变化为0.14 pF。两种类型的读出电路已被引入到微型传感器中,以消除寄生效应。最后,集成了一个芯片型ASIC芯片,并用此电容性压力进行测量。在施加的压力范围0-75 kPa上,相对电压变化的测量值为2.85%。传感器的灵敏度为0.92 mV kPa(-1),间隙为21毫米。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号