• 主题
高级搜索  >
历史搜索 清空历史
首页> 外文期刊>Journal of Micromechanics and Microengineering >A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (111) Si for MOEMS
【24h】

A molded surface-micromachining and bulk etching release (MOSBE) fabrication platform on (111) Si for MOEMS

机译：用于MOEMS的（111）Si上的模制表面微加工和整体蚀刻释放（MOSBE）制造平台

获取原文
获取原文并翻译 | 示例
           
页面导航
  • 摘要
  • 著录项
  • 相似文献
  • 相关主题

摘要

This work attempts to integrate poly-Si thin film and single-crystal-silicon (SCS) structures in a monolithic process. The process integrated multi-depth DRIE (deep reactive ion etching), trench-refilled molding, a two poly-Si MUMPs process and (111) Si bulk micromachining to accomplish multi-thickness and multi-depth structures for superior micro-optical devices. In application, a SCS scanning mirror driven by self-aligned vertical comb-drive actuators was demonstrated. The stiffness of the mirror was significantly increased by thick SCS structures. The thin poly-Si film served as flexible torsional springs and electrical routings. The depth difference of the vertical comb electrodes was tuned by DRIE to increase the devices' stroke. Finally, a large moving space was available after the bulk Si etching. In summary, the present fabrication process, named (111) MOSBE (molded surface-micromachining and bulk etching release on (111) Si substrate), can further integrate with the MUMPs devices to establish a more powerful platform.
机译：这项工作试图以单片工艺集成多晶硅薄膜和单晶硅（SCS）结构。该工艺集成了多深度DRIE（深反应离子刻蚀），沟槽填充成型，两个多晶硅MUMPs工艺以及（111）硅体微加工，以实现用于高级微光学器件的多厚度和多深度结构。在应用中，演示了由自对准垂直梳状驱动器驱动的SCS扫描镜。厚的SCS结构显着提高了镜子的刚度。多晶硅薄膜用作挠性扭转弹簧和电气布线。通过DRIE调整垂直梳状电极的深度差，以增加器件的行程。最后，在大块硅刻蚀之后有较大的移动空间。综上所述，本发明的制造工艺称为（111）MOSBE（在（111）Si基板上进行模制表面微加工和批量蚀刻释放），可以进一步与MUMPs器件集成以建立更强大的平台。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱：kefu@zhangqiaokeyan.com

京公网安备：11010802029741号 ICP备案号：京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有

  • 客服微信

  • 服务号