A 1500 mum x 1200 mum silicon scanning mirror has been fabricated by using anodic bonding and flip chip bonding. This scanning mirror is mainly composed of two structures having vertical comb fingers. By anodic bonding between the silicon wafer and the Pyrex glass substrate, and following deep inductively coupled plasma reactive ion etching (ICPRIE), isolated comb electrodes were fabricated at the lower structure. However, gold signal lines for electrical connection to the electrodes, which were inserted between silicon and Pyrex glass, were damaged during anodic bonding. This problem was solved by using the proposed processes and signal lines were successfully fabricated with the contact resistance below several tens of ohms. By flip chip bonding, the upper and lower structures having vertical comb fingers were assembled. Vertical comb fingers of two structures were aligned with a microscope and the frames of two structures were bonded at 300 degreesC for 20 s using the eutectic bonding material-electroplated AuSn. Finally, the scanning mirror was successfully fabricated and could be used for laser display as a galvanometric vertical scanner. [References: 10]
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机译：通过使用阳极键合和倒装芯片键合已经制造了1500 m x 1200 m的硅扫描镜。该扫描镜主要由具有垂直梳齿的两个结构组成。通过在硅片和派热克斯玻璃基板之间进行阳极键合，并在进行深感应耦合等离子体反应离子刻蚀（ICPRIE）之后，在下部结构上制造了隔离的梳状电极。但是，在阳极键合过程中，插入到硅和派热克斯玻璃之间的用于与电极电连接的金信号线损坏了。通过使用所提出的方法解决了这个问题，并且成功地制造了具有低于几十欧姆的接触电阻的信号线。通过倒装芯片接合，组装了具有垂直梳齿的上下结构。将两个结构的垂直梳齿用显微镜对准，并且使用共晶接合材料电镀的AuSn在300℃下将两个结构的框架接合20秒。最终，成功地制造了扫描镜，可以将其用作振镜式垂直扫描仪用于激光显示。 [参考：10]
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