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首页> 外文期刊>Journal of Micromechanics and Microengineering >Electrical discharge across micrometer-scale gaps for planar MEMS structures in air at atmospheric pressure
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Electrical discharge across micrometer-scale gaps for planar MEMS structures in air at atmospheric pressure

机译:大气压下空气中平面MEMS结构的跨微米级间隙的放电

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摘要

We examine electrical discharge current responses across atmospheric pressure air gaps in the 2 μm to 7 μm range between planar polysilicon microstructures to determine the physical process of electrical discharge. The effect on discharge response from shape-related field enhancement is investigated through simulated field distribution and experimental current response for devices with design variations in electrode shape. Initial Townsend discharges, between 50 pA and 400 pA, transitioned to a second stage of 2 nA to 20 nA when the applied voltage increased 13% to 21% above the initial breakdown voltage.
机译:我们检查了平面多晶硅微结构之间2μm至7μm范围内的大气压气隙的放电电流响应,以确定放电的物理过程。通过模拟场分布和具有电极形状设计变化的器件的实验电流响应,研究了形状相关的场增强对放电响应的影响。当施加电压比初始击穿电压增加13%至21%时,最初的Townsend放电(介于50 pA和400 pA之间)过渡到第二阶段,即2 nA至20 nA。

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