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首页> 外文期刊>Journal of Micromechanics and Microengineering >A self-assembled 3D microelectrode array
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A self-assembled 3D microelectrode array

机译：自组装的3D微电极阵列

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摘要

Recording a neural ensemble has been an extremely successful experimental paradigm allowing real-time interpretation of neural codes as well as the detection of dynamic changes within a process. In recent years, microfabricated electrodes have attracted a great deal of attention for recording neural ensembles with superior resolution and spatial density. A 3D microfabricated electrode is particularly attractive since it yields enhanced performance with regard to spike sorting and single unit detection. In this paper, we describe a self-assembly process for fabricating 3D microelectrode arrays in silicon. The electrode array is composed of four silicon shanks (200μm wide, 4 mm long and 30μm thick) with polyimide-filled V-groove joints at the back end and four 20 × 20 μm~2 recording sites (200 μm separation) at the tip. The shanks automatically fold to a vertical configuration upon proper heat treatment, hence creating a 3D configuration without the need for any manual assembly. Impedance and electrical test-signal measurements were used to verify the electrode functionality after the folding process.
机译：记录神经集合体是一种非常成功的实验范例，它可以实时解释神经代码以及检测过程中的动态变化。近年来，微细加工电极以高分辨力和空间密度记录神经元引起了广泛的关注。 3D微型电极特别吸引人，因为它在尖峰分拣和单个单元检测方面产生了增强的性能。在本文中，我们描述了一种在硅中制造3D微电极阵列的自组装过程。电极阵列由四个硅棒（宽200μm，长4mm，厚30μm）组成，在其后端有聚酰亚胺填充的V形沟槽，在尖端有四个20×20μm〜2个记录位点（间隔200μm） 。适当的热处理后，刀柄会自动折叠成垂直形状，因此无需任何手动组装即可创建3D形状。在折叠过程之后，使用阻抗和电测试信号测量来验证电极功能。

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