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Processing heat-shrink materials with laser radiation in operations involving the assembly of optical elements

机译:在涉及光学元件组装的操作中用激光辐射处理热缩材料

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摘要

This paper discusses the possibilities of laser technology in operations involving the assembly of optical elements, using heat-shrink materials. It is shown that, by choosing the radiation parameters, spatial localization of the heating that is adequate for shaping can be achieved in a polymeric material but still does not result in undesirable heating of the item being assembled. A process is described that uses the proposed method to assemble an electro-optic modulator based on a DKDP crystal.
机译:本文讨论了使用热缩材料在涉及光学元件组装的操作中使用激光技术的可能性。示出了,通过选择辐射参数,可以在聚合物材料中实现足以用于成形的加热的空间局部化,但是仍然不会导致不希望的被组装物品的加热。描述了一种使用所提出的方法组装基于DKDP晶体的电光调制器的过程。

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