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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Study of electroless copper plating onto PVDF modified by radio frequency plasma treatment
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Study of electroless copper plating onto PVDF modified by radio frequency plasma treatment

机译：射频等离子体处理改性PVDF化学镀铜的研究

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摘要

Surface properties of polyvinylidene fluoride (PVDF) films have been modified by treatment in a radio frequency (RF) nitrogen plasma, at different treatment powers (25, 50 and 75 W). The surface properties of the PVDF films before and after RF plasma treatment, as well as the quality of the deposited copper layer, were investigated by various investigation methods (Scanning electron microscopy, atomic force microscopy, ATR-FTIR and contact angle measurements). RF plasma treatment significantly improved the adherence and the quality of the deposited metal layer. The results obtained for PVDF RF plasma treated were compared with those corresponding to a microwave plasma treatment.
机译：聚偏二氟乙烯（PVDF）膜的表面性能已通过在射频（RF）氮等离子体中以不同的处理功率（25、50和75 W）进行处理而得到改性。通过各种研究方法（扫描电子显微镜，原子力显微镜，ATR-FTIR和接触角测量）研究了RF等离子体处理前后的PVDF膜的表面性质以及沉积的铜层的质量。 RF等离子体处理显着改善了沉积金属层的附着力和质量。将通过PVDF RF等离子体处理获得的结果与对应于微波等离子体处理的结果进行比较。

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