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首页> 外文期刊>Journal of Physics, D. Applied Physics: A Europhysics Journal >Thickness and grain size dependent mechanical properties of Cu films studied by nanoindentation tests
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Thickness and grain size dependent mechanical properties of Cu films studied by nanoindentation tests

机译：通过纳米压痕试验研究了铜膜厚度和晶粒尺寸相关的机械性能

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摘要

The hardness and the elastic modulus of Cu films with thickness (t) and grain size (d) have been investigated by nanoindentation tests. The d and the indentation depth increase linearly with the increase in t. The hardness rises with the decrease in t, whereas the elastic modulus is independent of t and it is about 20% less than conventional coarse-grained Cu. The enhanced hardness is attributed to the smaller d and the indentation depth. The analysis of load-displacement curves indicates that the scope of the critical shear stress for different thick Cu films ranges from 3.2 to 4.1 GPa, which is similar to the theoretical shear stress of single crystalline Cu. The present results are explained by the dislocation mediated mechanism even if d reaches about 16.4 nm for the Cu film with t = 180 nm.
机译：通过纳米压痕试验研究了厚度（t）和晶粒尺寸（d）的Cu膜的硬度和弹性模量。 d和压痕深度随t的增加而线性增加。硬度随着t的减小而增加，而弹性模量与t无关，并且比常规的粗晶粒Cu约小20％。硬度的提高归因于较小的d和压痕深度。载荷-位移曲线分析表明，不同厚度的Cu膜的临界剪切应力范围为3.2至4.1 GPa，与单晶Cu的理论剪切应力相似。即使d对于t ＝ 180nm的Cu膜而言，即使d达到约16.4nm，也通过位错介导的机理解释了本发明的结果。

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