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首页> 外文期刊>資源と素材: 资源·素材学会志 >Recovery of Copper, Tin and Lead from the Spent Printed Circuit Boards (PCBs) by the Shape Separation Method
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Recovery of Copper, Tin and Lead from the Spent Printed Circuit Boards (PCBs) by the Shape Separation Method

机译：通过形状分离法从废旧印刷电路板（PCB）中回收铜，锡和铅

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摘要

A study on the recovery of metallic components from the spent printed circuit boards (PCBs) was conducted using a shape separation technique. PCBs were pulverized to under 1 mm by a swing hammer type impact mill to liberate various metallic components after all electronic parts were removed in advance. The milled PCBs were subjected to the shape separation process using an inclined vibrating plate (IVP) to separate metal particles from nonmetallic components. The effect of vibration intensity and inclined angle on the metal separation efficiency were investigated. The optimum operation conditions for IVP were at the vibration intensity (K_v) of l.40 and the inclined angle of l0 deg. By optimizing the operation conditions, it was possible to obtain the recovery and grade of the metallic components over 90 percent.
机译：使用形状分离技术进行了从废印刷电路板（PCB）中回收金属组件的研究。预先取下所有电子零件后，用摆锤式冲击式粉碎机将PCB粉碎至1毫米以下，以释放各种金属成分。使用倾斜振动板（IVP）对经过研磨的PCB进行形状分离过程，以将金属颗粒与非金属组件分离。研究了振动强度和倾斜角对金属分离效率的影响。 IVP的最佳工作条件是振动强度（K_v）为1.40，倾斜角为10度。通过优化操作条件，可以获得超过90％的金属成分的回收率和品位。

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