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Influence of copper and silicon contents crack in copper alloyed aluminum silicon alloy using electron beam welding

机译:电子束焊接对铜合金铝硅合金中铜和硅含量裂纹的影响

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摘要

The surface hardening technology based on electronbeam has extended the possibilities for improving the wear andheat resistance of aluminum alloy. In this paper, surface hardenedaluminum alloy containing 20 to 75 mass% copper and 0 to 13mass% silicon by fusing aluminum silicon alloy and a copper wireusing electron beam was formed for studying the influence ofcopper and silicon contents on weld crack in surface hardenedaluminum silicon alloy using electron beam welding after weldingor heat treatment (water quenching). It is found that the crackeasily occurs with increasing copper and silicon contents in surfacehardened aluminum alloy through the increase of intermetalliccompound, CuAl2 , and the primary silicon.
机译:基于电子束的表面硬化技术扩展了改善铝合金耐磨性和耐热性的可能性。本文通过熔合铝硅合金和铜线并用电子束形成含20〜75质量%铜和0〜13质量%硅的表面硬化铝合金,研究了铜和硅含量对表面硬化铝硅合金焊接裂纹的影响。焊接或热处理(水淬)后的电子束焊接。发现通过金属间化合物,CuAl2和一次硅的增加,裂纹会随着表面硬化铝合金中铜和硅含量的增加而容易发生。

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