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首页> 外文期刊>Bioresource Technology: Biomass, Bioenergy, Biowastes, Conversion Technologies, Biotransformations, Production Technologies >Mold appearance and modeling on selected corn stover components during moisture sorption
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Mold appearance and modeling on selected corn stover components during moisture sorption

机译：水分吸收过程中选定玉米秸秆组件的模具外观和建模

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摘要

Occurrence of mold was visually monitored for 26 days on samples of major anatomical components of corn stover maintained at several storage temperatures (T) and water activities (a(w)). Glass desiccators with saturated salt solutions placed in temperature controlled chambers provided simulated storage conditions with temperatures ranging from 10 degrees C to 40 degrees C and water activities ranging from 0.11 to 0.98. Mold affected leaf, stalk skin, and stalk pith equally at water activity greater than 0.9. As expected, a combination of increased water activity greater than 0.9 and temperatures greater than 30 degrees C was conducive to mold growth. Based on material moisture content during tile initial mold growth, it was postulated that among the corn stover components the stalk pith was the least resistant to mold growth followed by stalk skin and leaf for the studied range of temperature and water activity. Mold growth models fitted well with the observation. A linear mold-free days predictions using a three-parameter regression model (T, a(w), and T x a(w)) was superior (R-2 = 0.99) to other models considered. The exponential spoilage model using two parameter T and a(w) also gave comparable performance (R-2 = 0.95). Among tile independent factors, T x a(w) product was the most significant (p = 0.0069) followed by T (p = 0.0114), and a(w) (p = 0.3140) in explaining the experimental data. The developed models can be applied to predict the safe storage period of corn stover components exposed to various temperature and moisture environmental conditions. (c) 2007 Elsevier Ltd. All rights reserved.
机译：在保持在几个储存温度（T）和水活度（a（w））下，对玉米秸秆主要解剖成分的样品进行26天的目视监测，以观察霉菌的发生。将装有饱和盐溶液的玻璃干燥器置于温度可控的室内，可提供模拟存储条件，温度范围为10摄氏度至40摄氏度，水分活度范围为0.11至0.98。在水分活度大于0.9时，使受害的叶片，茎杆皮肤和茎杆髓平均发霉。如所预期的，大于0.9的水活度和大于30℃的温度的组合有利于霉菌的生长。根据瓷砖初始霉菌生长过程中的材料水分含量，可以推测，在研究的温度和水分活度范围内，玉米秸秆组件中，玉米秸秆对霉菌生长的抵抗力最低，其次是茎皮和叶片。霉菌生长模型与观察结果非常吻合。使用三参数回归模型（T，a（w）和T x a（w））进行的无霉菌天数线性预测优于（R-2 = 0.99）。使用两个参数T和a（w）的指数腐败模型也给出了可比较的性能（R-2 = 0.95）。在独立因素中，T x a（w）乘积是最显着的（p = 0.0069），其次是T（p = 0.0114）和a（w）（p = 0.3140），以解释实验数据。所开发的模型可用于预测暴露于各种温度和湿度环境条件下的玉米秸秆组件的安全存储期。 （c）2007 Elsevier Ltd.保留所有权利。

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