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Error analysis of compensation cutting technique for wavefront error of KH_2PO_4 crystal

机译：KH_2PO_4晶体波前误差补偿切割技术的误差分析

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摘要

Considering the wavefront error of KH_2PO_4 (KDP) crystal is difficult to control through face fly cutting process because of surface shape deformation during vacuum suction, an error compensation technique based on a spiral turning method is put forward. An in situ measurement device is applied to measure the deformed surface shape after vacuum suction, and the initial surface figure error, which is obtained offline, is added to the in situ surface shape to obtain the final surface figure to be compensated. Then a three-axis servo technique is utilized to cut the final surface shape. In traditional cutting processes, in addition to common error sources such as the error in the straightness of guide ways, spindle rotation error, and error caused by ambient environment variance, three other errors, the in situ measurement error, position deviation error, and servo-following error, are the main sources affecting compensation accuracy. This paper discusses the effect of these three errors on compensation accuracy and provides strategies to improve the final surface quality. Experimental verification was carried out on one piece of KDP crystal with the size of Φ270 mm × 11 mm. After one compensation process, the peak-to-valley value of the transmitted wavefront error dropped from 1.9λ (λ = 632.8 nm) to approximately 1/3λ, and the mid-spatial-frequency error does not become worse when the frequency of the cutting tool trajectory is controlled by use of a low-pass filter.
机译：鉴于KH_2PO_4（KDP）晶体的波阵面误差由于真空抽吸过程中由于表面形状变形而难以通过面蝇切割工艺来控制，因此提出了一种基于螺旋转向法的误差补偿技术。使用原位测量装置测量真空抽吸后的变形表面形状，并将离线获得的初始表面图形误差添加到原位表面形状中，以获得要补偿的最终表面图形。然后，使用三轴伺服技术切割最终的表面形状。在传统的切割过程中，除了常见的误差源外，例如导轨的直线度误差，主轴旋转误差和由环境变化引起的误差，另外三个误差是原位测量误差，位置偏差误差和伺服误差。跟随误差是影响补偿精度的主要来源。本文讨论了这三个误差对补偿精度的影响，并提供了改善最终表面质量的策略。对一块尺寸为Φ270mm×11 mm的KDP晶体进行了实验验证。经过一个补偿过程，透射波前误差的峰谷值从1.9λ（λ= 632.8 nm）下降到大约1 /3λ，并且当频率变化时，中空间频率误差不会变差。切削刀具的轨迹通过使用低通滤波器来控制。

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