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Preparation of Fe-doped colloidal SiO2 abrasives and their chemical mechanical polishing behavior on sapphire substrates

机译:掺铁胶体SiO2磨料的制备及其在蓝宝石衬底上的化学机械抛光性能

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摘要

Abrasives are one of key influencing factors on surface quality during chemical mechanical polishing (CMP). Silica sol, a widely used abrasive in CMP slurries for sapphire substrates, often causes lower material removal rate (MRRs). In the present paper, Fe-doped colloidal SiO2 composite abrasives were prepared by a seed-induced growth method in order to improve the MRR of sapphire substrates. The CMP performance of Fe-doped colloidal SiO2 abrasives on sapphire substrates was investigated using UNIPOL-1502 CMP equipment. Experimental results indicate that the Fe-doped colloidal SiO2 composite abrasives exhibit lower surface roughness and higher MRR than pure colloidal SiO2 abrasives for sapphire substrates under the same testing conditions. Furthermore, the acting mechanism of Fe-doped colloidal SiO2 composite abrasives in sapphire CMP was analyzed by x-ray photoelectron spectroscopy. Analytical results show that the Fe in the composite abrasives can react with the sapphire substrates to form aluminum ferrite (AlFeO3) during CMP, which promotes the chemical effect in CMP and leads to improvement of MRR. (C) 2015 Optical Society of America
机译:磨料是化学机械抛光(CMP)过程中影响表面质量的关键因素之一。二氧化硅溶胶是用于蓝宝石衬底的CMP浆料中广泛使用的磨料,通常会降低材料去除率(MRR)。为了提高蓝宝石基体的MRR,本文采用晶种诱导法制备了Fe掺杂的SiO2胶体复合磨料。使用UNIPOL-1502 CMP设备研究了掺Fe的胶体SiO2磨料在蓝宝石衬底上的CMP性能。实验结果表明,在相同的测试条件下,掺铁的胶体SiO2复合磨料比纯胶体的SiO2磨料具有更低的表面粗糙度和更高的MRR。此外,通过X射线光电子能谱分析了掺Fe的胶体SiO 2复合磨料在蓝宝石CMP中的作用机理。分析结果表明,在CMP过程中,复合磨料中的Fe能与蓝宝石基体反应形成铁酸铝(AlFeO3),从而促进了CMP中的化学作用并改善了MRR。 (C)2015年美国眼镜学会

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