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Detection of defects on the surface of a semiconductor by terahertz surface plasmon polaritons

机译：通过太赫兹表面等离子体激元极化子检测半导体表面上的缺陷

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摘要

We propose a new method for detecting small defects on the surface of a semiconductor by analyzing the transmission spectrum of terahertz surface plasmon polaritons. The field distributions caused by the detection of defects of different sizes are simulated. Experimentally, using a terahertz time domain spectrometer, we measure the transmission spectrum of terahertz surface plasmon polaritons passing through particles on the surface of an intrinsic InSb wafer. Our results show that the measured temporal waveform and frequency spectra are distinctly changed due to the presence of the particles, thereby confirming the effectiveness of this method for detecting defects. For increased detection efficiency, the frequency of the surface plasmon polaritons has to be slightly lower than the plasma frequency of the semiconductor. In comparison with traditional methods, our approach offers the merits of detecting both on-surface and subsurface defects, which is critical in monitoring the quality of semiconductor wafers. (C) 2016 Optical Society of America
机译：我们提出了一种通过分析太赫兹表面等离子体激元的透射光谱来检测半导体表面小缺陷的新方法。模拟了由不同尺寸缺陷的检测引起的场分布。在实验上，使用太赫兹时域光谱仪，我们测量了太赫兹表面等离激元极化子通过本征InSb晶片表面上的粒子的透射光谱。我们的结果表明，由于颗粒的存在，所测量的时间波形和频谱发生了明显变化，从而证实了该方法检测缺陷的有效性。为了提高检测效率，表面等离子体激元极化子的频率必须略低于半导体的等离子体频率。与传统方法相比，我们的方法具有检测表面缺陷和表面缺陷的优点，这对于监控半导体晶圆的质量至关重要。 （C）2016美国眼镜学会

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