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A complete carbon-nanotube-based on-chip cooling solution with very high heat dissipation capacity

机译：完整的基于碳纳米管的片上冷却解决方案，具有很高的散热能力

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摘要

Heat dissipation is one of the factors limiting the continuous miniaturization of electronics. In the study presented in this paper, we designed an ultra-thin heat sink using carbon nanotubes (CNTs) as micro cooling fins attached directly onto a chip. A metal-enhanced CNT transfer technique was utilized to improve the interface between the CNTs and the chip surface by minimizing the thermal contact resistance and promoting the mechanical strength of the microfins. In order to optimize the geometrical design of the CNT microfin structure, multi-scale modeling was performed. A molecular dynamics simulation (MDS) was carried out to investigate the interaction between water and CNTs at the nanoscale and a finite element method (FEM) modeling was executed to analyze the fluid field and temperature distribution at the macroscale. Experimental results show that water is much more efficient than air as a cooling medium due to its three orders-of-magnitude higher heat capacity. For a hotspot with a high power density of 5000Wcm ~2, the CNT microfins can cool down its temperature by more than 40°C. The large heat dissipation capacity could make this cooling solution meet the thermal management requirement of the hottest electronic systems up to date.
机译：散热是限制电子器件持续小型化的因素之一。在本文提出的研究中，我们设计了一种超薄散热器，它使用碳纳米管（CNT）作为直接连接到芯片上的微散热片。利用金属增强的CNT转移技术，通过最小化热接触电阻并提高微鳍片的机械强度来改善CNT与芯片表面之间的界面。为了优化CNT微鳍结构的几何设计，进行了多尺度建模。进行了分子动力学模拟（MDS），研究了纳米级水与碳纳米管之间的相互作用，并进行了有限元方法（FEM）建模，以分析宏观尺度上的流场和温度分布。实验结果表明，由于水的热容量高出三个数量级，因此它比空气作为冷却介质要有效得多。对于具有5000Wcm〜2的高功率密度的热点，CNT微鳍片可以将其温度降低40°C以上。大的散热能力可使该冷却解决方案满足最新的最热电子系统的热管理要求。

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