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Realization of thermally durable close-packed 2D gold nanoparticle arrays using self-assembly and plasma etching

机译：使用自组装和等离子刻蚀实现热耐用的紧密堆积2D金纳米颗粒阵列

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Realization of thermally and chemically durable, ordered gold nanostructures using bottom-up self-assembly techniques are essential for applications in a wide range of areas including catalysis, energy generation, and sensing. Herein, we describe a modular process for realizing uniform arrays of gold nanoparticles, with interparticle spacings of 2nm and above, by using RF plasma etching to remove ligands from self-assembled arrays of ligand-coated gold nanoparticles. Both nanoscale imaging and macroscale spectroscopic characterization techniques were used to determine the optimal conditions for plasma etching, namely RF power, operating pressure, duration of treatment, and type of gas. We then studied the effect of nanoparticle size, interparticle spacing, and type of substrate on the thermal durability of plasma-treated and untreated nanoparticle arrays. Plasma-treated arrays showed enhanced chemical and thermal durability, on account of the removal of ligands. To illustrate the application potential of the developed process, robust SERS (surface-enhanced Raman scattering) substrates were formed using plasma-treated arrays of silver-coated gold nanoparticles that had a silicon wafer or photopaper as the underlying support. The measured value of the average SERS enhancement factor (2×10 ~5) was quantitatively reproducible on both silicon and paper substrates. The silicon substrates gave quantitatively reproducible results even after thermal annealing. The paper-based SERS substrate was also used to swab and detect probe molecules deposited on a solid surface.
机译：使用自下而上的自组装技术实现耐热和化学耐用，有序的金纳米结构对于在包括催化，能量产生和传感在内的广泛领域中的应用至关重要。在这里，我们描述了一种模块化的过程，该过程通过使用RF等离子刻蚀从配体包覆的金纳米颗粒的自组装阵列中去除配体，从而实现金纳米颗粒的均匀阵列（粒子间距为2nm以上）。纳米成像和宏观光谱表征技术均用于确定等离子体蚀刻的最佳条件，即RF功率，工作压力，处理时间和气体类型。然后，我们研究了纳米颗粒尺寸，颗粒间间距和基材类型对等离子体处理和未处理的纳米颗粒阵列的热耐久性的影响。由于去除了配体，等离子体处理的阵列显示出增强的化学和热耐久性。为了说明所开发工艺的应用潜力，使用经过等离子处理的镀银金纳米颗粒阵列形成了坚固的SERS（表面增强拉曼散射）基底，该阵列具有硅晶片或照相纸作为底层载体。平均SERS增强因子（2×10〜5）的测量值在硅和纸质基材上均可定量再现。即使在热退火之后，硅衬底也给出了定量可再现的结果。纸基SERS底物还用于擦拭和检测沉积在固体表面上的探针分子。

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