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Solution-processed soldering of carbon nanotubes for flexible electronics

机译：用于柔性电子产品的碳纳米管的固溶处理焊接

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We report a simple lithography-free, solution-based method of soldering of carbon nanotubes with Ohmic contacts, by taking specific examples of multi-walled carbon nanotubes (MWNTs). This is achieved by self-assembling a monolayer of soldering precursor, Pd~(2+) anchored to 1,10 decanedithiol, onto which MWNTs could be aligned across the gap electrodes via solvent evaporation. The nanosoldering was realized by thermal/electrical activation or by both in sequence. Electrical activation and the following step of washing ensure selective retention of MWNTs spanning across the gap electrodes. The soldered joints were robust enough to sustain strain caused during the bending of flexible substrates as well as during ultrasonication. The estimated temperature generated at the MWNT-Au interface using an electro-thermal model is ～150 °C, suggesting Joule heating as the primary mechanism of electrical activation. Further, the specific contact resistance is estimated from the transmission line model.
机译：我们通过采用多壁碳纳米管（MWNTs）的特定示例，报告了一种简单的无光刻，基于解决方案的碳纳米管与欧姆接触焊接方法。这是通过自组装单层焊接前体Pd〜（2+）固定在1,10癸二硫醇上实现的，MWNT可以通过溶剂蒸发在间隙电极上对齐。纳米焊接通过热/电激活或通过两者同时实现。电激活和随后的清洗步骤确保了跨间隙电极的MWNT的选择性保留。焊接接头足够坚固，可以承受在挠性基板弯曲以及超声波处理期间引起的应变。使用电热模型估计的在MWNT-Au界面产生的温度约为150°C，这表明焦耳热是电激活的主要机理。此外，从传输线模型估计比接触电阻。

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