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Focused electron beam induced etching of copper in sulfuric acid solutions

机译:聚焦电子束诱导的硫酸溶液中铜的蚀刻

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摘要

We show here that copper can be locally etched by an electron-beam induced reaction in a liquid. Aqueous sulfuric acid (H2SO4) is utilized as the etchant and all experiments are conducted in an environmental scanning electron microscope. The extent of etch increases with liquid thickness and dose, and etch resolution improves with H2SO4 concentration. This approach shows the feasibility of liquid phase etching for material selectivity and has the potential for circuit editing.
机译:我们在这里表明,铜可以通过电子束在液体中引起的反应而被局部蚀刻。硫酸(H2SO4)用作蚀刻剂,所有实验均在环境扫描电子显微镜中进行。蚀刻的程度随液体厚度和剂量的增加而增加,蚀刻分辨率随H2SO4浓度的提高而提高。这种方法显示了液相蚀刻对材料选择性的可行性,并具有进行电路编辑的潜力。

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