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首页> 外文期刊>Nanotechnology >Patterning gold nanoparticles in liquid environment with high ionic strength for local fabrication of up to 100 mu m long metallic interconnections
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Patterning gold nanoparticles in liquid environment with high ionic strength for local fabrication of up to 100 mu m long metallic interconnections

机译：在具有高离子强度的液体环境中对金纳米粒子进行图案化，以局部制造长达100微米的金属互连

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Metallic interconnections were fabricated in situ using the FluidFM as scanning probe lithography tool. In contrast to other SPL tools, the closed fluidic circuit of the FluidFM enables a pressure-controlled deposition of metallic nanoparticles in liquid environment. Taking advantage of the salt concentration of the liquid environment (i.e. the ionic strength) to tailor the resulting particle density in the deposited layer, a protocol was established for direct patterning of conductive interconnecting structures. The FluidFM microchannel was filled with an aqueous solution of negatively charged gold nanoparticles (AuNPs) to be delivered onto a glass surface coated with a polycation favoring electrostatic adhesion. The deposited structures were analyzed both topographically and electrically to optimize the external parameters such as contact time, salt concentration of the liquid environment and size of the AuNPs. Using this optimized protocol we succeeded in the local fabrication of conductive metallic wires between two prefabricated macroelectrodes in liquid environment. In a subsequent step, the conductivity of the deposited structure was improved by gold annealing.
机译：使用FluidFM作为扫描探针光刻工具原位制作金属互连。与其他SPL工具相比，FluidFM的封闭式流体回路可在液体环境中对金属纳米颗粒进行压力控制沉积。利用液体环境中的盐浓度（即离子强度）来调整沉积层中的最终颗粒密度，建立了一种用于对导电互连结构进行直接构图的协议。 FluidFM微通道充满了带负电的金纳米颗粒（AuNPs）的水溶液，并被输送到涂有聚阳离子的玻璃表面上，从而有利于静电粘附。对沉积的结构进行了形貌和电学分析，以优化外部参数，例如接触时间，液体环境中的盐浓度和AuNPs的大小。使用这种优化的协议，我们成功地在液态环境中的两个预制大电极之间局部制造了导电金属线。在随后的步骤中，通过金退火改善了沉积结构的电导率。

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