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首页> 外文期刊>Nanotechnology >High integrity interconnection of silver submicronanoparticles on silicon wafer by femtosecond laser irradiation
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High integrity interconnection of silver submicronanoparticles on silicon wafer by femtosecond laser irradiation

机译：飞秒激光辐照在硅片上银亚微米/纳米粒子的高完整性互连

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摘要

Welding of nanomaterials is a promising technique for constructing nanodevices with robust mechanical properties. To date, fabrication of these devices is limited because of difficulties in restricting damage to the nanomaterials during the welding process. In this work, by utilizing very low fluence (similar to 900 mu J cm(-2)) femtosecond (fs) laser irradiation, we have produced a metallic interconnection between two adjacent silver (Ag) submicronanoparticles which were fixed on a silicon (Si) wafer after fs laser deposition. No additional filler material was used, and the connected particles remain almost damage free. Observation of the morphology before and after joining and finite difference time domain simulations indicate that the interconnection can be attributed to plasmonic excitation in the Ag submicronanoparticles. Concentration of energy between the particles leads to local ablation followed by re-deposition of the ablated material to form a bridging link that joins the two particles. This welding technique shows potential applications in the fabrication of nanodevices.
机译：纳米材料的焊接是一种具有良好机械性能的有前途的技术。迄今为止，由于难以在焊接过程中限制对纳米材料的损坏，因此限制了这些装置的制造。在这项工作中，通过使用非常低的通量（类似于900μJ cm（-2））的飞秒（fs）激光辐射，我们在两个相邻的固定在硅上的银（Ag）亚微米/纳米粒子之间产生了金属互连fs激光沉积后的（Si）晶片。无需使用其他填充材料，并且连接的颗粒几乎没有损坏。在连接和有限时域仿真之前和之后的形态观察表明，互连可以归因于Ag亚微米/纳米粒子中的等离子体激元激发。粒子之间的能量集中导致局部烧蚀，然后再沉积烧蚀的材料以形成连接两个粒子的桥接链。这种焊接技术显示出在纳米器件制造中的潜在应用。

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