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Reliable fabrication of plasmonic nanostructures without an adhesion layer using dry lift-off

机译:使用干剥离技术可靠地制造无粘附层的等离激元纳米结构

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摘要

Lift-off is the most commonly used pattern-transfer method to define lithographic plasmonic metal nanostructures. A typical lift-off process is realized by dissolving patterned resists in solutions, which has the limits of low yield when not using adhesion layers and incompatibility with the fabrication of some specific structures and devices. In this work, we report an alternative 'dry' lift-off process to obtain metallic nanostructures via mechanical stripping by using the advantage of poor adhesion between resists and noble metal films. We show that this dry stripping lift-off method is effective for both positive-and negative-tone resists to fabricate sparse and densely-packed plasmonic nanostructures, respectively. In particular, this method is achieved without using an adhesion layer, which enables the mitigation of plasmon damping to obtain larger field enhancement. Dark-field scattering, one-photon luminescence and surface-enhanced Raman scattering measurements were performed to demonstrate the improved quality factor of the plasmonic nanostructures fabricated by this dry lift-off process.
机译:剥离是定义光刻等离子体金属纳米结构的最常用的图案转移方法。典型的剥离工艺是通过将图案化的抗蚀剂溶解在溶液中来实现的,这种方法的局限性在于不使用粘合层时产量低以及与某些特定结构和器件的制造不兼容。在这项工作中,我们报告了另一种“干式”剥离工艺,该工艺利用抗蚀剂和贵金属膜之间的不良粘合力,通过机械剥离获得金属纳米结构。我们表明,这种干法剥离剥离方法对于分别制造稀疏和密集堆积的等离激元纳米结构的正负抗蚀剂均有效。特别地,该方法无需使用粘附层即可实现,该粘附层能够减轻等离激元阻尼,从而获得更大的场增强。进行了暗场散射,单光子发光和表面增强拉曼散射测量,以证明通过这种干剥离工艺制造的等离子体纳米结构的质量因数得到改善。

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