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首页> 外文期刊>RSC Advances >Effect of temperature and alloying elements ( Fe and Bi) on the electrical resistivity of Sn-0.7Cu solder alloy
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Effect of temperature and alloying elements ( Fe and Bi) on the electrical resistivity of Sn-0.7Cu solder alloy

机译：温度和合金元素（铁和铋）对Sn-0.7Cu焊料合金电阻率的影响

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摘要

In this paper, we investigated the electrical resistivity as a function of temperature of the Sn-0.7Cu solder alloy with the addition of Fe and Bi. The electrical resistivity were characterized by the four-point probe method. Apparent change in electrical resistivity was witnessed by the addition of both Fe and Bi. At room temperature, the electrical resistivity was found to be increased with the addition of Fe, as well as a further increase with the addition of Bi. Fe and Bi modified Sn-0.7Cu alloys also experienced the similar increasing trend when they were subjected to higher temperatures within the range of 300-423 K. Chemical state of Sn was analyzed by means of X-ray photoelectron spectroscopy (XPS). The results revealed the presence of Sn in Sn2+, Sn4+ and state of metallic Sn. With the addition of Fe & Bi, a substantial decrease was observed in the atomic percent of the Sn4+ chemical state. X-ray diffraction (XRD) was performed on the alloys. The XRD pattern showed disturbance in the 2 theta values with the addition of Bi. The disturbance confirmed the presence of stress and imperfections in the crystal lattice. Field emission scanning electron microscope (FESEM) micrographs revealed the formation of the FeSn2 intermetallic compound with the addition of Fe. However, the addition of Bi promotes the formation of solid solution and goes into primary beta-Sn dendrites. Microstructural changes, shifts in the chemical state of Sn and a disturbance in the XRD peaks resulting from the addition of Fe and Bi have been correlated to the variation in electrical resistivity.
机译：在本文中，我们研究了添加Fe和Bi的Sn-0.7Cu焊料合金的电阻率随温度的变化。用四点探针法表征电阻率。 Fe和Bi的添加都见证了电阻率的明显变化。在室温下，发现电阻率随着添加铁而增加，并且随着添加铋而进一步增加。 Fe和Bi改性的Sn-0.7Cu合金在300-423 K的高温下也经历了相似的增长趋势。通过X射线光电子能谱（XPS）分析了Sn的化学态。结果表明Sn2 +，Sn4 +中存在Sn和金属Sn的状态。通过添加Fe和Bi，可以观察到Sn4 +化学态的原子百分数大大降低。对合金进行X射线衍射（XRD）。 X射线衍射图谱显示，添加Bi会干扰2θ值。干扰证实了晶格中存在应力和缺陷。场发射扫描电子显微镜（FESEM）显微照片揭示了在添加Fe的情况下FeSn2金属间化合物的形成。但是，Bi的添加促进了固溶体的形成，并进入了主要的β-Sn树突中。微观结构的变化，Sn的化学状态的变化以及由于添加Fe和Bi导致的XRD峰扰动均与电阻率变化相关。

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