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首页> 外文期刊>Optics Letters >Combining wet etching and real-time damage event imaging to reveal the most dangerous laser damage initiator in fused silica
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Combining wet etching and real-time damage event imaging to reveal the most dangerous laser damage initiator in fused silica

机译：结合湿法蚀刻和实时损伤事件成像，发现熔融石英中最危险的激光损伤引发剂

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摘要

A reliable method, combining a wet etch process and real-time damage event imaging during a raster scan laser damage test, has been developed to directly determine the most dangerous precursor inducing low-density laser damage at 355 nm in fused silica. It is revealed that ～16% of laser damage sites were initiated at the place of the scratches, ～49% initiated at the digs, and ～35% initiated at invisible defects. The morphologies of dangerous scratches and digs were compared with those of moderate ones. It is found that local sharp variation at the edge, twist, or inside of a subsurface defect is the most dangerous laser damage precursor.
机译：已经开发出一种可靠的方法，将光栅扫描激光损伤测试中的湿蚀刻工艺与实时损伤事件成像相结合，可以直接确定最危险的前驱体在熔融石英中在355 nm处引起低密度激光损伤。结果表明，约有16％的激光损伤部位是在划痕处产生的，约49％的是在凹痕处产生的，约35％的是在看不见的缺陷处产生的。将危险的划痕和凹痕的形态与中等的划痕和凹痕的形态进行比较。发现在表面缺陷的边缘，扭曲或内部局部急剧变化是最危险的激光损伤前兆。

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