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首页> 外文期刊>Physica, B. Condensed Matter >Effects of solute, temperature and strain on the electrical resistivity of Cu-Ag filamentary composites
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Effects of solute, temperature and strain on the electrical resistivity of Cu-Ag filamentary composites

机译：溶质，温度和应变对Cu-Ag丝状复合材料电阻率的影响

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摘要

The filamentary composites of Cu-6 wt%Ag, Cu-6 wt%Ag-0.2 wt%Zr and Cu-24 wt%Ag were prepared by heavy drawing. The electrical resistivity at various temperatures and draw ratios was determined in order to investigate the effects of the solute concentration, measured temperature and strain level on the electrical conductivity. The conductivity of all tested composites, especially for Cu-6 wt%Ag, decreases with the temperature increasing from 77 to 293 K Minor constituent Zr or high Ag content in the filamentary composites significantly impairs the conductivity at temperatures lower than 293 K. The resistivity at 77-293 K slightly increases but at 373-573 K slightly decreases with the draw ratio increasing from 6.1 to 9.4 for Cu-6wt%Ag. Additional solute atoms, large interfacial area and high dislocation density in Cu-6wt% Ag-0.2wt%Zr and Cu-24wt%Ag are mainly responsible for the conductivity reduction. Dislocation scattering and interface scattering mainly affect the resistivity at low temperatures. Phonon scattering mainly affects the resistivity at high temperatures.
机译：通过重拉伸制备Cu-6wt％Ag，Cu-6wt％Ag-0.2wt％Zr和Cu-24wt％Ag的丝状复合材料。确定了在各种温度和拉伸比下的电阻率，以研究溶质浓度，测得的温度和应变水平对电导率的影响。当温度从77 K增加到293 K时，所有测试的复合材料（尤其是Cu-6 wt％Ag的）的电导率都会降低，丝状复合材料中的微量Zr或高Ag含量会显着损害低于293 K的温度下的电导率。 Cu-6wt％Ag的拉伸比从77-293 K略有增加，而373-573 K则略有降低。 Cu-6wt％Ag-0.2wt％Zr和Cu-24wt％Ag中的其他溶质原子，较大的界面面积和高位错密度是造成电导率降低的主要原因。位错散射和界面散射主要影响低温下的电阻率。声子散射主要影响高温下的电阻率。

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